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an26011a 1 ver. ceb z cellular phone 800mhz / 450mhz band application simplified application applications features description lna-ic for 800mhz / 450mhz band applications an26011a is lna-ic for 800mhz / 450mhz band applications. realizing high performance by using 0.18 m sigec bi-cmos process(f t = 90 ghz, f max = 140 ghz). low gain mode is availabl e, controlled by integrated cmos logic circuit. achieving miniaturization by using small size package. notes) this application circuit is an example. the operation of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. ? low voltage operation +2.80 v typ. ? high gain 15.0 db typ. frx = 881.5 mhz 16.0 db typ. frx = 450 mhz ? low noise figure 1.40 db typ. frx = 881.5 mhz 1.30 db typ. frx = 450 mhz ? low distortion (iip3 +10 mhz offset) +10.0 dbm typ. frx = 881.5 mhz +10.0 dbm typ. frx= 450 mhz ? 5 pin plastic small surface mount package (smini type) murata GJM0332C1E4R0BB01D 4.0 pf 0603 c3 murata lqpt03tn10nh04 10 nh 0603 l3 murata lqpt03tn12nh04 12 nh 0603 l2 murata grm033b11c102kd01 1000 pf 0603 c1 murata grm033b30j104ke18 0.1 f 0603 c4 vendor part number value size components murata GJM0332C1E4R0BB01D 4.0 pf 0603 c2 murata lqpt03tn12nh04 12 nh 0603 l1 c4 v cc c1 out in gnd v cc cnt (gain control) c3 l3 54 1 2 3 l2 l1 c2 50 in 50 out top view publication date: march 2013
an26011a 2 ver. ceb absolute maximum ratings *4 v ? 0.3 to (v cc +0.3) cnt (pin no.3) ? ma 18 i cc supply current *2 c ?40 to +125 t j operating junction temperature *4 v ? 0.3 to (v cc +0.3) out (pin no.5) input voltage range *3 v ? in (pin no.1) *2 c ?55 to +125 t stg storage temperature ? v 1500 hbm (human body model) esd note unit rating symbol parameter *2 c ?20 to +70 t opr operating ambient temperature *1 v 3.6 v cc supply voltage notes). this product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rati ng. this rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated recommended operating range. when subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. *1:the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2:except for the operating ambient temperature, operating junction temperature and storage temperature, all ratings are for ta = 25 c. *3:rf signal input pin. do not apply dc. do not apply more than 0 dbm to rf input. *4:(vcc + 0.3) v must not be exceeded 3.6 v. 0.066w 0.12w 833 /w ssmini-5dc pd (ta=70 ) pd (ta=25 ) ja package power dissipation rating note). for the actual usage, please refer to the pd-ta c haracteristics diagram in the package specification, supply voltage, load and ambient te mperature conditions to ensure that t here is enough margin follow the power and the thermal design does not exceed the allowable value. caution although this has limited built-in esd protecti on circuit, but permanent damage may occur on it. therefore, proper esd precautions are recommended to avoid electrostatic damage to the mos gates recommended operating conditions 2.8 typ. 2.65 min. *1 v 2.95 v cc supply voltage range note unit max. symbol parameter note) * : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation
an26011a 3 ver. ceb ? a 10 0 ? current at cnt pin. voltage at cnt pin = 0 v icntls cnt current (low gain mode) ? a 10 0 ? v cc current at low gain mode. no input signal iccls supply current (low gain mode) ? a 35 5 ? current at cnt pin. voltage at cnt pin = 2.80 v icnths cnt current (high gain mode) ? v 3.1 ? 2.52 ? vihs cnt voltage (high gain mode) dc electrical characteristics ? v 0.3 0 ? ? vils cnt voltage (low gain mode) ? ma 14.5 11.5 ? v cc current at high gain mode. no input signal icchs supply current (high gain mode) limits typ unit max note min condition symbol parameter elecrtrical characteristics note) v cc = 2.80 v, t a = 25 c 2 c, unless otherwise specified. performance based on application circuit 1 on page 11. lna ac electrical characteristics ( low gain mode ) ? dbm ? 10.0 6.0 f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) iip3s iip3 +10 mhz offset ? db ?1.5 ?3.0 ?5.0 prx = ? 20 dbm gls power gain lg ? db 17.0 15.0 13.0 ? ghs power gain hg lna ac electrical characteristics ( high gain mode ) limits typ unit max note min condition symbol parameter elecrtrical characteristics (continued) note) vcc = 2.80 v, ta = 25 c 2 c, frx = 881.5 mhz, prx = ?30 dbm, cw unless otherwise specified. performance based on application circuit 1 on page 11.
an26011a 4 ver. ceb application information reference values for design note) vcc = 2.80 v ta = 25 c 2 c, frxa = 869 mhz, 881.5 mhz, 894 mhz, pr xa = ?30 dbm, cw unless otherwise specified. performance based on application circuit 1 on page 11. *1 db ? 7.5 5.5 ? s11ha input return loss hg *1 db ? 9.0 7.0 ? s22ha output return loss hg *1 dbm ? 10.0 6.0 f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h2a iip3 ?10 mhz offset hg *1 dbm ? ?6.0 ?10.0 ? ip1dbha input p1db *1 db ?18.0 ?22.0 ? ? isoha reverse isolation hg *1 dbm ? 20.0 17.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz prxa = ?15 dbm input 2 signals (f1, f2) iip3l1a iip3 +10 mhz offset lg *1 db ?1.5 ?3.0 ?5.0 prxa = ?20 dbm gla power gain lg *1 db 5.5 3.0 ? ? nfla noise figure lg lna ac electrical characteristics ( low gain mode ) *1 db ? 9.0 7.0 ? s11la input return loss lg *1 db ? 7.5 5.5 ? s22la output return loss lg *1,*2 db 2.1 1.5 ? ? nfha noise figure hg *1 dbm ? 10.0 6.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3h1a iip3 +10 mhz offset hg lna ac electrical characteristics ( high gain mode ) *1 db 17.0 15.0 13.0 ? gha power gain hg *1 db ?1.5 ?3.0 ?5.0 ? isola reverse isolation lg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : rf input connector & substrate loss (0.1 db) included.
an26011a 5 ver. ceb *1 db ? 4.0 2.5 ? s11hb input return loss hg *1 db ? 7.5 5.5 ? s22hb output return loss hg *1 dbm ? 11.5 7.5 f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h2b iip3 ?10 mhz offset hg *1 dbm ? ?5.0 ?9.0 ? ip1dbhb input p1db *1 db ?18.0 ?22.0 ? ? isohb reverse isolation hg *1 dbm ? 20.0 17.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz prxa = ?15 dbm input 2 signals (f1, f2) iip3l1b iip3 +10 mhz offset lg *1 db ?2.5 ?4.0 ?6.0 prxa = ?20 dbm glb power gain lg *1 db 6.5 4.0 ? ? nflb noise figure lg lna ac electrical characteristics ( low gain mode ) *1 db ? 5.0 2.5 ? s11lb input return loss lg *1 db ? 5.0 2.5 ? s22lb output return loss lg *1,*2 db 2.0 1.4 ? ? nfhb noise figure hg *1 dbm ? 11.5 7.5 f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3h1b iip3 +10 mhz offset hg lna ac electrical characteristics ( high gain mode ) *1 db 16.0 14.0 12.0 ? ghb power gain hg *1 db ?2.5 ?4.0 ?6.0 ? isolb reverse isolation lg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : rf input connector & substrate loss (0.1 db) included. application information (continued) reference values for design (continued) note) vcc = 2.80 v ta = 25 c 2 c, frxa = 869 mhz, 881.5 mhz, 894 mhz, pr xa = ?30 dbm, cw unless otherwise specified. performance based on application circuit 2 on page 11.
an26011a 6 ver. ceb *1 db ? 7.5 5.5 ? s11hc input return loss hg *1 db ? 7.5 5.0 ? s22hc output return loss hg *1 dbm ? 10.0 6.5 f1 = frxb ? 10 mhz f2 = frxb ? 20 mhz input 2 signals (f1, f2) iip3h2c iip3 ?10 mhz offset hg *1 dbm ? ?7.0 ?11.0 ? ip1dbhc input p1db *1 db ?20.0 ?24.0 ? ? isohc reverse isolation hg *1 dbm ? 25.0 22.0 f1 = frxb + 10 mhz f2 = frxb + 20 mhz prxb = ?10 dbm input 2 signals (f1, f2) iip3l1c iip3 +10 mhz offset lg *1 db ?1.5 ?3.0 ?4.5 prxb = ?20 dbm glc power gain lg *1 db 5.0 3.0 ? ? nflc noise figure lg lna ac electrical characteristics ( low gain mode ) *1 db ? 10.0 8.5 ? s11lc input return loss lg *1 db ? 15.0 12.0 ? s22lc output return loss lg *1,*2 db 2.1 1.4 ? ? nfhc noise figure hg *1 dbm ? 10.0 6.5 f1 = frxb + 10 mhz f2 = frxb + 20 mhz input 2 signals (f1, f2) iip3h1c iip3 +10 mhz offset hg lna ac electrical characteristics ( high gain mode ) *1 db 18.0 16.0 14.0 ? ghc power gain hg *1 db ?1.5 ?3.0 ?4.5 ? isolc reverse isolation lg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : rf input connector & substrate loss (0.1 db) included. application information (continued) reference values for design (continued) note) vcc = 2.80 v ta = 25 c 2 c, frxb = 440 mhz, 450 mhz, 460 mhz, prxb = ?30 dbm, cw unless otherwise specified. performance based on application circuit 3 on page 12.
an26011a 7 ver. ceb *1 a 45 5 ? current at cnt pin voltage at cnt pin = 2.80 v icntht cnt current (high gain mode) *1 ma 15.5 11.5 ? vcc current at high gain mode no input signal iccht supply current (high gain mode) *1 a 20 0 ? vcc current at low gain mode no input signal icclt supply current (low gain mode) *1 a 20 0 ? current at cnt pin voltage at cnt pin = 0 v icntlt cnt current (low gain mode) dc electrical characteristics reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. application information (continued) reference values for design (continued) note) vcc = 2.65 v to 2.95 v ta = -20 c to 70 c, cw unless otherwise specified. performance based on application circuit 1 on page 11.
an26011a 8 ver. ceb *1 dbm ? 10.0 5.0 f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h2ta iip3 ?10 mhz offset hg *1 dbm ? ?6.0 ?15.0 ? ip1dbhta input p1db *1 dbm ? 20.0 15.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz prxa = ? 15 dbm input 2 signals (f1, f2) iip3lt1a iip3 +10 mhz offset lg *1 db ?1.0 ?3.0 ?5.5 prxa = ? 20 dbm glta power gain lg *1 db 7.0 3.0 ? ? nflta noise figure lg lna ac electrical characteristics ( low gain mode ) *1,*2 db 2.4 1.5 ? ? nfhta noise figure hg *1 dbm ? 10.0 5.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3h1ta iip3 +10 mhz offset hg lna ac electrical characteristics ( high gain mode ) *1 db 18.0 15.0 12.0 ? ghta power gain hg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : rf input connector & substrate loss (0.1 db) included. application information (continued) reference values for design (continued) note) vcc = 2.65 v to 2.95 v ta = -20 c to 70 c, frxa = 869 mhz, 881.5 mhz, 894 mhz, prxa = ?30 dbm, cw unless otherwise specified. performance based on application circuit 1 on page 11.
an26011a 9 ver. ceb *1 dbm ? 11.5 6.5 f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h2tb iip3 ?10 mhz offset hg *1 dbm ? ?5.0 ?14.0 ? ip1dbhtb input p1db *1 dbm ? 20.0 15.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz prxa = ?15 dbm input 2 signals (f1, f2) iip3lt1b iip3 +10 mhz offset lg *1 db ?2.0 ?4.0 ?6.5 prxa = ?20 dbm gltb power gain lg *1 db 8.0 4.0 ? ? nfltb noise figure lg lna ac electrical characteristics ( low gain mode ) *1,*2 db 2.3 1.4 ? ? nfhtb noise figure hg *1 dbm ? 11.5 6.5 f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3h1tb iip3 +10 mhz offset hg lna ac electrical characteristics ( high gain mode ) *1 db 17.0 14.0 11.0 ? ghtb power gain hg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : rf input connector & substrate loss (0.1 db) included. application information (continued) reference values for design (continued) note) vcc = 2.65 v to 2.95 v ta = -20 c to 70 c, frxa = 869 mhz, 881.5 mhz, 894 mhz, prxa = ?30 dbm, cw unless otherwise specified. performance based on application circuit 2 on page 11.
an26011a 10 ver. ceb *1 dbm ? 10.0 5.0 f1 = frxb ? 10 mhz f2 = frxb ? 20 mhz input 2 signals (f1, f2) iip3h2tc iip3 ?10 mhz offset hg *1 dbm ? ?7.0 ?16.0 ? ip1dbhtc input p1db *1 dbm ? 25.0 20.0 f1 = frxb + 10 mhz f2 = frxb + 20 mhz prxb = ?10 dbm input 2 signals (f1, f2) iip3lt1c iip3 +10 mhz offset lg *1 db ?1.0 ?3.0 ?5.0 prxb = ?20 dbm gltc power gain lg *1 db 6.5 3.0 ? ? nfltc noise figure lg lna ac electrical characteristics ( low gain mode ) *1,*2 db 2.4 1.4 ? ? nfhtc noise figure hg *1 dbm ? 10.0 5.0 f1 = frxb + 10 mhz f2 = frxb + 20 mhz input 2 signals (f1, f2) iip3h1tc iip3 +10 mhz offset hg lna ac electrical characteristics ( high gain mode ) *1 db 19.0 16.0 13.0 ? ghtc power gain hg reference values typ unit max note min conditions symbol parameter note) *1 : checked by design, not production tested. *2 : rf input connector & substrate loss (0.1 db) included. application information (continued) reference values for design (continued) note) vcc = 2.65 v to 2.95 v ta = -20 c to 70 c, frxb = 440 mhz, 450 mhz, 460 mhz, prxb = ?30 dbm, cw unless otherwise specified. performance based on application circuit 3 on page 12.
an26011a 11 ver. ceb application information (continued ) application circuit [ application circuit 1 for 800 mhz band ] notes) this application circuit is an example. the operation of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. murata GJM0332C1E4R0BB01D 4.0 pf 0603 c3 murata lqpt03tn10nh04 10 nh 0603 l3 murata lqpt03tn12nh04 12 nh 0603 l2 murata grm033b11c102kd01 1000 pf 0603 c1 murata grm033b30j104ke18 0.1 f 0603 c4 vendor part number value size components murata GJM0332C1E4R0BB01D 4.0 pf 0603 c2 murata lqpt03tn12nh04 12 nh 0603 l1 c4 v cc c1 out in gnd v cc cnt (gain control) c3 l3 54 1 2 3 l2 l1 c2 50 in 50 out top view [ application circuit 2 for 800 mhz band ] notes) this application circuit is an example. the operation of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. murata lqpt03tn10nh04 10 nh 0603 l3 murata lqpt03tn12nh04 12 nh 0603 l2 murata grm033b11c102kd01 1000 pf 0603 c1 murata grm033b30j104ke18 0.1 f 0603 c3 vendor part number value size components murata GJM0332C1E4R0BB01D 4.0 pf 0603 c2 murata lqp03t56nj04 56 nh 0603 l1 c3 v cc c1 out in gnd v cc cnt (gain control) c2 l3 54 1 2 3 l2 l1 50 in 50 out top view
an26011a 12 ver. ceb application information (continued ) application circuit (continued) [ application circuit 3 for 450 mhz band ] notes) this application circuit is an example. the operation of mass production set is not guaranteed. you should perform enough evaluation and verification on the design of mass production set. you are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. murata gjm0332c1e4r5bb01d 4.5 pf 0603 c3 murata grm033b30j104ke18 0.1 f 0603 c4 murata grm033b11c102kd01 1000 pf 0603 c2 panasonic erj2gej100x 10 1005 r1 murata lqp03t22nh04 22 nh 0603 l2 panasonic erj2gej132x 1.3 k 1005 r2 panasonic ecj0ec1h0r5c 0.5 pf 1005 c5 vendor part number value size components murata gjm0334c1e2r0bb01 2.0 pf 0603 c1 murata lqpt03tn12nh04 12 nh 0603 l1 c4 v cc c1 out in gnd v cc cnt (gain control) c3 l2 54 1 2 3 r1 l1 c2 50 in 50 out top view r2 c5
an26011a 13 ver. ceb pin functions v cc power supply vcc 4 high gain / low gain switch l: low gain mode h: high gain mode input cnt 3 gnd ground gnd 2 rf input input in 1 rf output output out 5 description type pin name pin no. pin configuration top view functional block diagram out in gnd v cc cnt logic gain select 54 123 in gnd cnt out vcc 1 2 3 5 4 top view notes) this circuit and these circuit constants show an example and do not guarantee the design as a mass-production set. this block diagram is for explaining func tions. the part of the block diagram may be omitted, or it may be simplified.
an26011a 14 ver. ceb package information ( reference data ) unit:mm lead finish method : snbi plating lead material : cu alloy body material : br / sb free epoxy resin 0 to 0.05 0.55 0.05 (0.5) (0.5) 1.00 0.05 (7) 1.60 0.05 0.20 +0.05 -0.02 1.20 0.05 1.60 0.05 0.13 +0.05 -0.02 (7) 1 2 3 4 5 0.20 0.05 (0.27) 0.10 package code:ssmini-5dc
an26011a 15 ver. ceb important notice 1.the products and product specificat ions described in this book are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to ma ke sure that the latest specifications satisfy your requirements. 2.when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 3.when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descr iptions and the usage notes in the book. 4.the technical information described in this book is inten ded only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any ot her company which may arise as a result of the use of technical information de-scribed in this book. 5.this book may be not reprinted or r eproduced whether wholly or partially, without the prior written permission of our company. 6.this lsi is intended to be used for general electronic equipment [880 mhz / 450 mhz band applications]. consult our sales staff in advance for information on the following applications: special applications in which exceptional quality and reliability are required, or if the failu re or malfunction of this lsi may directly jeopardize life or harm the human body. any applications other than t he standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliabili ty equivalent to (1) to (7) is required it is to be understood that our company sh all not be held responsible for any damage incurred as a result of or in connection with your using the lsi described in this book for any special application, unless our company agrees to your using the lsi in this book for any special application. 7.this lsi is neither designed nor intended for use in aut omotive applications or envir onments unless the specific product is designated by our company as comp liant with the iso/ts 16949 requirements. our company shall not be held responsible for any damage incu rred by you or any third party as a result of or in connection with your using the lsi in automotive application, unle ss our company agrees to your using the lsi in this book for such application. 8.if any of the products or technical in formation described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially , those with regard to security export control, must be observed. 9. please use this product in compliance with all applicable laws and regulations that regul ate the inclusion or use of controlled substances, including without limitation, the eu rohs directive. our company shall not be held responsible for any damage incurred as a result of your using the lsi not complying with the applicable laws and regulations.
an26011a 16 ver. ceb usage notes 1. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc. ). especially, please be careful not to exceed the range of absolute maximum rati ng on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed val ues, take into the consideration of incidence of break down and failure mode, possible to occur to semi conductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are reco mmended in order to prevent physical injury, fire, social damages, for example, by using the products. 2. comply with the instructions for use in order to pr event breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mo unting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 3. pay attention to the direction of lsi. when mounting it in the wrong di rection onto the pcb (printed-circuit- board), it might smoke or ignite. 4. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 5. perform a visual inspection on the pcb before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of t he semiconductor device. also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the lsi during transportation. 6. take notice in the use of this pr oduct that it might break or occasionally smoke when an abnormal state occurs such as output pin-vcc short (power supply fault), out put pin-gnd short (ground faul t), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended becaus e the extent of the above- mentioned damage and smoke emission will depend on the current capability of the power supply.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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